PCB Singulation

The demand for faster compact electronics devices pushes the printed circuit boards (PCB) toward multilayered smaller sizes, which makes it more complicated to singulate the boards after fabrication.

Picosecond laser systems can be used for singulating PCBs with minimal heat affected zone. The non-thermal ablation process of picosecond pulses makes it possible to cut circuits with <10µm affected zone around the cutting line. Same laser systems can be used for marking the boars (e.g. printing the serial number, barcode, etc.) at the same time.
Some examples of the PCB processing are shown here. To see a larger version, please click on each picture.

Side view of a cut on a PCB sample using a commercial CW CO2 laser (left) and a picosecond laser system (right).


Note the differences between the heat affected zone (HAZ) for a cut from CW CO2 laser (left) and a picosecond laser system (right).

Marking on the PCB using Attodyne’s picosecond laser system.